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AMD Ryzen 5000 and Zen 3 on Nov 5th: +19% IPC, Claims Best Gaming CPU - AnandTech
Dr. Lisa Su, the CEO of AMD, has today announced the company’s next generation mainstream Ryzen processor. The new family, known as the Ryzen 5000 series, includes four parts and supports up to sixteen cores. The key element of the new product is the core design, with AMD’s latest Zen 3 microarchitecture, promising a 19% raw increase in performance-per-clock, well above recent generational improvements. The new processors are socket-compatible with existing 500-series motherboards, and will be available at retail from November 5th. AMD is putting a clear marker in the sand, calling one of its halo products as ‘The World’s Best Gaming CPU’. We have details. Four Processors, All Coming November 5th With the new Ryzen 5000 series, AMD is keeping a similar structure to the previous generation. The first four processors to market will include products in the key Ryzen 5 and Ryzen 7 segments, as well as a pair of high-performance parts with Ryzen 9. These will stretch from six cores to sixteen cores, with increased frequencies and increased performance-per-clock, but with no additional increase in power. The processors are still chiplet-based, with one chiplet having either six or eight cores. Ryzen 5 and Ryzen 7 will have one chiplet, while Ryzen 9 will have two chiplets – the easy way to identify this is through the amount of L3 cache each processor has.
|AMD Ryzen 5000 Series ProcessorsZen 3 Microarchitecture|
|Ryzen 9 5950X||16c/32t||3400||4900||64 MB||105 W||$799|
|Ryzen 9 5900X||12c/24t||3700||4800||64 MB||105 W||$549|
|Ryzen 7 5800X||8c/16t||3800||4700||32 MB||105 W||$449|
|Ryzen 5 5600X||6c/12t||3700||4600||32 MB||65 W||$299*|
- +2.7% Cache Prefetching
- +3.3% Execution Engine
- +1.3% Branch Predictor
- +2.7% Micro-op Cache
- +4.6% Front End
- +4.6% Load/Store
The ASUS ZenFone 7 Pro Review: The Triple Flip-Camera - AnandTech
ASUS last week released the brand new ZenFone 7 and ZenFone 7 Pro series, and today’s we’re ready to publish our testing of the company’s newest “mainsteam” flagship device. This year’s ZenFone 7 series, consisting of the regular ZenFone 7 and the ZenFone 7 Pro are sticking to the quite well received and innovative flip-camera design, improving upon its specification by adding in an extra camera module. We’ve also seen key specification improvements on the part of the phone itself, with an important shift from an LCD screen to a new 90Hz AMOLED display, as well as adoption of Qualcomm’s newest Snapdragon 865 and 865+ chipsets. This year, the company is also releasing two variants of the phone – beyond higher DRAM and storage configurations, the higher-end model features a higher-binned SoC as well as differentiates the camera systems by exclusively employing OIS – which is an interesting way to segment things.
|ASUS ZenFone 7 Series|
|ZenFone 7||ZenFone 7 Pro|
|SoC||Qualcomm Snapdragon 8651x Cortex A77 @ 2.84GHz3x Cortex A77 @ 2.42GHz4x Cortex A55 @ 1.80GHzAdreno 650 @ 587MHz||Qualcomm Snapdragon 865+1x Cortex A77 @ 3.1GHz3x Cortex A77 @ 2.42GHz4x Cortex A55 @ 1.80GHzAdreno 650 @ 670MHz|
|DRAM||6 GB LPDDR5||8 GB LPDDR5|
|Storage||128GB UFS 3.1+ microSD||256GB UFS 3.1+ microSD|
|Display||6.67" AMOLED2400 x 1080 (20:9)90Hz200Hz Touch|
|Battery Capacity||5000mAh30W charging (PD3.0)|
|Main||64MP IMX6860.8µm pixels (1.6µm 4:1 16MP)f/1.7||64MP IMX6860.8µm pixels (1.6µm 4:1 16MP)f/1.7 w/OIS|
|Telephoto||8MP3x optical zoomf/2.4||8MP3x optical zoomf/2.4 w/OIS|
|Wide||12MP IMX3631.4µm pixels Dual PDAF113° FoV ultra-widef/2.2|
|Front Camera||Flip-camera DesignFront cameras = Rear cameras|
|Wireless (local)||802.11ax WiFi-6Bluetooth 5.1 LE + NFC|
|Other Features||Triple-function Power Button w/ Capacitive Fingerprint Sensor|
|Launch Price||21,999 TWD(USD~748, EUR~626)||27990 TWD(USD~952, EUR~797)|
Mandatory Socialization: Facebook Accounts To be Required for Oculus Headsets - AnandTech
Signaling the end to any remaining degrees of separation between Facebook and its VR headset division, Oculus, today the social media company announced that...
Signaling the end to any remaining degrees of separation between Facebook and its VR headset division, Oculus, today the social media company announced that it will be further integrating the two services. Coming this fall, the company will begin sunsetting stand-alone Oculus accounts as part of an effort to transition the entire Oculus ecosystem over to Facebook. This will start in October, when all new Oculus accounts and devices will have to sign up for a Facebook account, while support for existing stand-alone accounts will be retired entirely at the start of 2023. Originally an acquisition for Facebook, the Oculus Rift and underlying Oculus software ecosystem were initially developed by the then-independent Oculus VR group. After acquiring the company for $2 Billion back in 2014, Facebook has for the last several years largely treated Oculus as a stand-alone entity, selling products under the Oculus brand and leaving Facebook integration an optional feature – a feature co-founder Palmer Luckey even guaranteed during the 2014 acquisition. None the less, Oculus’s days as a stand-alone ecosystem are now coming to a close, as Facebook has laid out their plans to transition Oculus users over to Facebook accounts, and the significant social media repercussions that entails. According to Facebook, winding-down Oculus accounts will be a two-part process for the company. Starting in October, all new accounts will need to be Facebook accounts – or more specifically, users will need a Facebook account to log into the Oculus ecosystem. Meanwhile current stand-alone Oculus account holders will be grandfathered in for a time on their existing devices, however any future unreleased devices, even when paired with an existing Oculus account, will still require a Facebook login. Facebook will then maintain support for grandfathered accounts through the start of 2023. At that point the company will officially drop support for stand-alone Oculus accounts, and while the company is not threatening to immediately disconnect or disable non-Facebook users, “full functionality will require a Facebook account.” In particular: We will take steps to allow you to keep using content you have purchased, though some games and apps may no longer work. This could be because they require a Facebook account or because a developer has chosen to no longer support the app or game you purchased. Ultimately, for Facebook this marks the final step of the Oculus acquisition, more fully integrating the company and its systems into the larger Facebook ecosystem. Facebook’s primary strength as a service provider to end-users remains its social offerings, so the company cannot fully exploit those strengths so long as Oculus users remain outside the Facebook ecosystem. At the same time, this will also give the revenue-generating side of Facebook significantly more access to information about Oculus users, which the company will then be able to use to use for targeted advertising, usage tracking, and other purposes.
Intel Xe-HPC GPU Status Update: 4 Process Nodes Make 1 Chip - AnandTech
Continuing today’s GPU news from Intel’s Architecture Day presentation, on top of the Xe-LP architecture briefing and Xe-HPG reveal, the company has also offered...
Continuing today’s GPU news from Intel’s Architecture Day presentation, on top of the Xe-LP architecture briefing and Xe-HPG reveal, the company has also offered a brief roadmap update for their flagship sever-level part, Xe-HPC. Better known by its codename of Ponte Vecchio, much to do has been made about Xe-HPC. The most complex of the Xe parts planned, it is also the cornerstone of the Intel-powered Aurora supercomputer. Xe-HPC is pulling out all of the stops for performance, and to get there Intel is employing every trick in the book, including their new-generation advanced packaging technologies. The big revelation here is that we finally have some more concrete insight into what manufacturing processes the various tiles will use. The base tile of the GPU will be on Intel’s new 10nm SuperFin process, and the Rambo Cache will be a generation newer still, using Intel’s future 10nm Enhanced SuperFin process. Meanwhile it’s now confirmed that the Xe Link I/O tile, which will be used as part of Intel’s fabric to link together multiple Xe-HPC GPUs, will be built by an external fab. That leaves the matter of the compute tile, the most performance-critical of the GPU’s parts. With Intel’s 7nm process delayed by at least six months, the company has previously disclosed that they were going to take a “pragmatic” approach and potentially use third-party fabs. And as of their Architecture Day update, they still seem to be undecided about – or at least unwilling to disclose – just what they plan on doing. Instead, the compute die is labeled as “Intel Next Gen & External”. It's an unusual disclosure, to say the least, as we'd otherwise expect the compute die to be made on a single process. But with no further commentary from Intel offered, make of that what you will. Perhaps they’re being straightforward, and they will actually use two very different process nodes for the compute die?
US Appeals Court Reverses Antitrust Ruling in FTC vs Qualcomm - AnandTech
It’s been over three years since the United States FTC had charged Qualcomm with antitrust violations over cellular modem patents and business practices. That...
It’s been over three years since the United States FTC had charged Qualcomm with antitrust violations over cellular modem patents and business practices. That suit ultimately received a ruling in May of 2019 against Qualcomm, resulting in an injunction for Qualcomm to renegotiate its licensing agreements with its customers. Qualcomm had subsequently appealed the ruling, putting the order on hold, and today, a bit over a year later, the Ninth Circuit Court of Appeals has finally issued an opinion, reversing and vacating the injunction, resulting in a win for Qualcomm at this moment in time. The appeals court’s opinion centres around the FTC’s use of anti-trust law to hold Qualcomm accountable for some of its controversial business practices in how it handles licensing of its patent portfolio and its “no license, no chip” mode of operation. The opinion attacks the original judgment in that the arguments presented do not fall under the umbrella of anti-trust law violations, and instead it being a matter of contract and patent law. The original charge revolved around Qualcomm’s supposed refusal to license cellular patents to competitor chip vendors, with the company countering this accusation that its patents only apply to OEM products, not the chips of components themselves: “Qualcomm argues that it has no antitrust duty to deal with its rivals, and in any case OEM-level licensing is consistent with Qualcomm’s SSO commitments because only OEM products (i.e., cellphones, tablets, etc.) “practice” or “implement” the standards embodied in Qualcomm’s SEPs. Furthermore, Qualcomm argues that it substantially complies with the TIA and ATIS requirements by not asserting its patents against rival chipmakers.” The appeals panel has upheld Qualcomm’s notion and point-of-view of the practice, stating that there is no antitrust law which prohibits the company from applying licensing arrangements in this way. More precisely, the matter of Qualcomm collecting royalties from OEMs is said to be due a change in patent law, that forced the company to stop giving non-exhaustive licenses to other chip vendors: “… Qualcomm claims that it never granted exhaustive licenses to rival chip suppliers. Instead, as the 1999 email suggests, it entered into “non-exhaustive, royalty-bearing agreements with chipmakers that explicitly did not grant rights to the chipmaker’s customers.” Appellant’s Opening Br. at 45. According to Qualcomm, it ceased this practice in response to developments in patent law’s exhaustion doctrine, see, e.g., Quanta Comput., 553 U.S. at 625 (noting that “the initial authorized sale of a patented item terminates all patent rights to that item”), which made it harder for Qualcomm to argue that it could provide “non-exhaustive” licenses in the form of royalty agreements.” Because Qualcomm applies this practice equally between all OEMs, and there is no history of the company ever granting exhaustive licenses to a chip vendor, the appeals panel also failed to determine any anticompetitive behaviour on the part of the company, calling Qualcomm’s business model “chip-supplier neutral”, and does not undermine competition in the antitrust market. “… Qualcomm’s practice of licensing its SEPs exclusively at the OEM level does not amount to anticompetitive conduct in violation of § 2, as Qualcomm is under no antitrust duty to license rival chip suppliers.” As Qualcomm is seen as not having performed any anticompetitive behaviour in terms of its willingness to license patents to OEMs, and the fact that it gives a “CDMA ASIC” waiver license to chip vendors for free in order for them to internally exercise the technology before they sell it onto their customers, its refusal to give chip vendors non-exhaustive patent licenses is not seen as a matter of antitrust law, and the original ruling to be void in this regard. The appeal opinion also addresses the third matter of the alleged exclusivity deal that Qualcomm had entered with Apple in 2011 and 2013, that given the effect of this deals had not stifled the competition (And arguing with the fact that Intel had subsequently won Apple contracts in following years), that it also did not go against antitrust law. Overall, the opinion of the appeals panel today represents a major blow to the FTC and its original legal tactic and usage of antitrust law. Whilst this is a major win for the company, it’s not completely out of the woods as the company’s practises could still be in violation of contract and patent law: “To the extent Qualcomm has breached any of its FRAND commitments, a conclusion we need not and do not reach, the remedy for such a breach lies in contract and patent law.” While currently Qualcomm can continue its business practises licensing model, it’s likely to continue to receive future scrutiny in regards to the amount of the fees it charges. Related Reading:
Intel Adds Core i9-10850K To Desktop Chip Lineup: 10 Cores Minus 100MHz - AnandTech
Intel this morning is taking the wraps off of a new Core i9 processor that it’s adding to its family of Comet Lake desktop CPUs. Taking its place as the closest thing to a budget option in the i9 pile, the i9-10850K is a slightly lower-clocked version of Intel’s flagship 10-core i9-10900K processor. Overall the chip is clocked 100MHz slower than the 10900K in every aspect, from base clocks to turbo clocks, a rather small increment at a time when Intel’s chips boost to over 5000Mhz. Meanwhile, although Intel has yet to publish an official price, expect to see the 10850K priced a bit lower than the $488 10900K.
|Intel 10th Gen Comet LakeCore i9 and Core i7|
AMD Launches 12 Desktop Renoir Ryzen 4000G Series APUs: But You Can't Buy Them - AnandTech
Today AMD is finally lifting the lid on its long-awaited desktop Zen2 based APU family. Using the same silicon as in the Ryzen Mobile 4000 family, AMD is pumping it up into 35 W and 65 models in the same AM4 platform that is in use today. There has been strong demand from PC builders to release these chips, which were on the topics of forum conversation all the way back at CES. There’s only one downside to these new processors: you can’t buy them on their own. AMD states that the initial release of Ryzen 4000G hardware is for OEMs like Dell and HP only for their pre-built systems. The new processors use the same 8-core Zen2 plus 8 compute unit Vega that we saw in Ryzen Mobile 4000 at the beginning of the year, but as with previous APU launches, the frequency and power thermals have been pushed up into more manageable desktop environments. To that end, AMD will be launching hardware in the Ryzen 7, Ryzen 5, and Ryzen 3 product lines at both 65 W and 35 W, all on the AM4 platform.
|AMD Ryzen 4000G Series APUs|
|Ryzen 7 4700G||8 / 16||3600||4400||8||2100||65 W|
|Ryzen 7 4700GE||8 / 16||3100||4300||8||2000||35 W|
|Ryzen 5 4600G||6 / 12||3700||4200||7||1900||65 W|
|Ryzen 5 4600GE||6 / 12||3300||4200||7||1900||35 W|
|Ryzen 3 4300G||4 / 8||3800||4000||6||1700||65 W|
|Ryzen 3 4300GE||4 / 8||3500||4000||6||1700||35 W|
|Ryzen Pro 4000G|
|Ryzen 7 Pro 4700G||8 / 16||3600||4400||8||2100||65 W|
|Ryzen 7 Pro 4750GE||8 / 16||3100||4300||8||2000||35 W|
|Ryzen 5 Pro 4650G||6 / 12||3700||4200||7||1900||65 W|
|Ryzen 5 Pro 4650GE||6 / 12||3300||4200||7||1900||35 W|
|Ryzen 3 Pro 4350G||4 / 8||3800||4000||6||1700||65 W|
|Ryzen 3 Pro 4350GE||4 / 8||3500||4000||6||1700||35 W|
|AMD Athlon 3000G Series|
|Athlon Gold 3150G||4 / 4||?||3900||3||?||65 W|
|Athlon Gold 3150GE||4 / 4||?||3800||3||?||35 W|
|Athlon Silver 3050GE||2 / 4||3400||-||3||?||35 W|
|Athlon Pro 3000G|
|Athlon Gold Pro 3150G||4 / 4||3500||3900||3||1100||65 W|
|Athlon Gold Pro 3150GE||4 / 4||3300||3800||3||1100||35 W|
|Athlon Silver Pro 3125GE||2 / 4||3400||-||3||1100||35 W|
AMD Announces Ryzen Threadripper Pro: Workstation Parts for OEMs Only - AnandTech
Last year we spotted that AMD was in the market to hire a new lead product manager for a ‘workstation division’. This was a categorically different position to the lead PM for high-end desktop, and so we speculated what this actually means. Today, AMD is announcing its first set of workstation products, under the Ryzen Threadripper Pro branding. However, it should be noted that these processors will only be available as part of pre-built systems, and no corresponding consumer motherboards will be made available. Taking Threadripper To Pro The product stack from AMD has included Ryzen Pro and Ryzen Mobile Pro hardware for a couple of generations – these processors offer ECC-enabled variants along with corporate support on security, manageability, and operating system image consistency. Most of us had assumed that while Ryzen had a Ryzen Pro variant, the most natural variant to Threadripper was AMD’s EPYC processor line of server processors. The server market and the high-end-desktop/workstation market have always sort of overlapped, and up to this point if a user was interested in a workstation-like design, with ECC and software validation, they would look to EPYC. Today AMD is changing that dynamic with Ryzen Threadripper Pro. Ryzen Threadripper Pro hardware will mirror single-socket EPYC in its features: eight memory channels up to DDR4-3200, 128 lanes of PCIe 4.0, support for RDIMMs and LRDIMMs, support for secure memory encryption, support for DASH manageability, and operating system image consistency as part of AMD’s Pro Business Ready programme. Where Ryzen Threadripper Pro differs is in the core count/frequency/TDP configurations.
|AMD Ryzen Threadripper Pro|
|3995WX||64 / 128||2700||4200||8 + 1||280 W||8 x DDR4-3200|
|3975WX||32 / 64||3500||4200||4 + 1||280 W||8 x DDR4-3200|
|3955WX||16 / 32||3900||4300||2 + 1||280 W||8 x DDR4-3200|
|3945WX||12 / 24||4000||4300||2 + 1||280 W||8 x DDR4-3200|
- Before Intel launched Xeon Scalable, it offered variants of its E5-2600 processor line as ‘workstation’ models, such as the E5-2687W v2/v3/v4. These were socket compatible with Intel’s high-end desktop processors without ECC, or could be used in server-grade motherboards with ECC validation.
- After this, Intel launched the Xeon W-2100 family, built upon Skylake, and offering up to 18 cores with quad-channel memory. These were on the LGA2066 high-end desktop socket, but required special motherboards that used server-only chipsets. These were updated with Xeon W-2200 variants, built on Cascade Lake.
- Alongside this, Intel had Xeon W-3100 and Xeon W-3200 workstation processors, for the LGA3647 socket, enabling six-channel memory and offering up to 28 cores. Intel even offered a special W-3175X model that was overclockable.
- Now this year, Intel added the Xeon W-1200 family to its workstation lineup, using the consumer LGA1200 socket, but again with motherboards that have a server-only chipset installed. These W-1200 actually replace the E-2300 processors, and the Xeon E family has been mothballed into Xeon W.
- On top of all this, Intel has Xeon Scalable Cascade Lake which have also been used extensively in workstations.
Lenovo's New ThinkPad P1 Gen3 for Professionals: OLED, 8-core Xeon, Quadro - AnandTech
At the high-end of Lenovo’s ThinkPad designs, where professionals need server-grade features like ECC and graphics focused on compute or rendering, we get the...
At the high-end of Lenovo’s ThinkPad designs, where professionals need server-grade features like ECC and graphics focused on compute or rendering, we get the P1 model which is updated for 2020 as the P1 Gen3. This notebook refresh is a 15.6-inch design, offering an OLED display, choice of Intel 10th Gen or Xeon processors, and Quadro-level graphics. The underlying design of the chassis is carbon fiber, aiming to be sturdy yet lightweight, with a fingerprint resistant finish to enhance the aesthetic of a premium system. The ThinkPad P1 Gen3 is a 15.6-inch design with options that include a 3840x2160 OLED touch display at HDR500, a 3840x2160 LCD IPS variant up to 600 nits, or a 1920x1080 IPS 500nit HDR lower-cost option. Under the hood it supports Intel’s 10th Gen Core mobile 45 W processors, or their Xeon equivalents, which extends support to up to 64 GB of ECC for the Xeons via two SoDIMM slots. Graphics are available up to an NVIDIA Quadro T2000. There are two M.2 drives in the system, allowing for up to 4 TB of NVMe SSDs in RAID 0/1, and the system comes with an 80 Wh battery. Two power supplies are available – a base 135 W slim model or a 170 W slim model. Operating system options include Windows 10 Home, Pro, Pro for Workstations, Ubuntu, Red Hat (certified), or Fedora. For professional users, the P1 Gen3 supports TPM, has a touch fingerprint reader for easy log-in, and a shutter mechanism for the 720p webcam. There is also an optional separate Hybrid IR camera. On the connectivity side, Intel’s AX201 Wi-Fi 6 solution is included as standard, but a CAT16 LTE smartphone modem is an optional extra, which comes in the M.2 form factor. The system is certified for a number of software vendors, such as AutoCAD, CATRIA, NX, SolidWorks, Revit, Creo, Inventor, etc. From the design, the unit comes with the usual ThinkPad bells and whistles. The keyboard includes the TrackPoint in the middle of the keyboard, and the track pad at the bottom has physical keys above it. The keyboard is backlit and spill resistant. Ports on the side include two USB 3.2 Gen 1 Type-A ports, two USB-C Thunderbolt 3 ports, a HDMI 2.0 video output, a 3.5mm jack, and an SD Card Reader. A suggested Lenovo Use Case The P1 Gen3 comes with Lenovo’s ThinkShield software, and will also be the recipient of Lenovo’s new Ultra Performance Mode that allows the user to adjust the performance settings in order to achieve a desired performance or thermal characteristics of the system. Lenovo believes this is mostly relevant to users who need full turbo to get a project completed on time, or for those who use the system with VR and require a minimum standard of performance without any potential thermal disruptions. The P1 Gen3 starting weight is 3.75 lbs (1.7 kg), which will add on with the addition of a graphics card / more memory / more storage etc. The Lenovo ThinkPad P1 Gen3 will be available from July, starting at $2019.
AMD Confirms That SmartShift Tech Only Shipping in One Laptop For 2020 - AnandTech
Launched earlier this year, AMD’s Ryzen 4000 “Renoir” APUs brought several new features and technologies to the table for AMD. Along with numerous changes...
Launched earlier this year, AMD’s Ryzen 4000 “Renoir” APUs brought several new features and technologies to the table for AMD. Along with numerous changes to improve the APU’s power efficiency and reduce overall idle power usage, AMD also added an interesting TDP management feature that they call SmartShift. Designed for use in systems containing both an AMD APU and an AMD discrete GPU, SmartShift allows for the TDP budgets of the two processors to be shared and dynamically reallocated, depending on the needs of the workload. As SmartShift is a platform-level feature that relies upon several aspects of a system, from processor choice to the layout of the cooling system, it is a feature that OEMs have to specifically plan for and build into their designs. Meaning that even if a laptop uses all AMD processors, it doesn’t guarantee that the laptop has the means to support SmartShift. As a result, only a single laptop has been released so far with SmartShift support, and that’s Dell’s G5 15 SE gaming laptop. Now, as it turns out, Dell’s laptop will be the only laptop released this year with SmartShift support. In a comment posted on Twitter and relating to an interview given to PCWorld’s The Full Nerd podcast, AMD’s Chief Architect of Gaming Solutions (and Dell alumni) Frank Azor has confirmed that the G5 15 SE is the only laptop set to be released this year with SmartShift support. According to the gaming frontman, the roughly year-long development cycle for laptops combined with SmartShift’s technical requirements meant that vendors needed to plan for SmartShift support early-on. And Dell, in turn, ended up being the first OEM to jump on the technology, leading to them being the first laptop vendor to release a SmartShift-enabled laptop. It's a brand new technology and to @dell credit they jumped on it first. I explained reasons why during my interview with @[email protected]@BradChacos No more SmartShift laptops are coming this year but the team is working hard on having more options ASAP for 2021. — Frank Azor (@AzorFrank) June 4, 2020 Azor’s comment further goes on to confirm that AMD is working to get more SmartShift-enabled laptops on the market in 2021; there just won’t be any additional laptops this year. Which leaves us in an interesting situation where, Dell, normally one of AMD's more elusive partners, has what's essentially a de facto exclusive on the tech for 2020.